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      均熱板(VC)是客制化產品

      作者:jcadmin 发布时间:2019-07-22 20:15:28

      均熱板(VC)是客制化產品

      Vapor Chamber is a designed and made by customer.
      requirements product.

      規格與功能 Specification & Function
      材质(Materials):
      銅 C1100
      Copper C1100
      封裝技術(Sealing Technique):
      擴散接合:高溫、高壓、真空、無銲?的製程,接合過程中材?晶?重新排?使接合面
      強?與母材相同。
      Diffusion Bonding: A high temperature, high pressure, vacuum, and no welding material
      process. During the bonding process, material grains re-arrange and make
      the bonding interface strength keep same as parent material.
      微結構(Wick Structure):
      擴散接合複合式多層銅網微結構,分級式微結構設計。
      Diffusion bonding bonded compound multi-layer mesh wick, Graded Wick Design.
      工作?體(Working Fluid):
      除氣純水,含氧? 10ppb 以下。
      De-gassed pure water, oxygen contain below 10 ppb

      外型(Shape):
      在沖壓製程容許下,可依客戶需求製成各種形?。
      Base on stamping process to fulfill customer requirements.

      尺寸大小(Size):
      30mmx30mm~300mmx300mm
      厚?(Thickness):
      2.0mm 以上,實際厚?視客戶實際需求而定,主要考?散熱需求、熱通?、鎖附??、
      VC 尺寸。
      Above 2.0mm, depend on requirements. The main considerations are heat dissipation, heat flux,
      loading force, VC size.
      熱通?(Heat Flux):
      1~300 Watt/cm2。
      穿孔(Thought Hole):
      在腔體內部允許穿孔設計,且可攻牙。
      Through holes inside VC is available; thread the through hole is available.
      凸台(Pedestal):
      可提供多台階式凸台設計。
      Mulit-steps pedestal is Available

      內部支撐結構(Internal supporting):
      銅柱,和上下蓋銅板接合。
      Copper columns, bonded with top and bottom plate.
      負載??(Loading Force):
      60LB 以上,可依客戶實際需求及機構條件?設計。
      Above 60lb and can be designed for customer practical requirements
      儲存溫?(Storage Temperature):
      -40℃~130℃
      操作溫?(Operate Temperature):
      0℃~130℃
      耐溫?(Sustained Temperature):
      可達 130~250℃,可依客戶實際需求?設計。
      From 130~250℃ and can be designed for customer practical requirements.
      冷熱衝擊(Thermal Shock):
      25℃~ -40℃~ 25℃~ 100℃~ 25℃,250次,如有特殊應用需求,可配合設計增加VC強?。
      25℃~ -40℃~ 25℃~ 100℃~ 25℃,250 cycle. Extra requirement can be achieved by
      individual design.
      平面?(Flatness):
      0.0003~0.003mm/mm,可依客戶實際需求?設計。
      0.0003~0.003mm/mm, can be designed for customer practical requirements.
      重?影響(Gravity Orientation):
      熱源與邊界距? 200mm 以內無影響。
      There is no impact about gravity orientation while the distance from heat source to VC side is
      within 200mm.
      成品加工(Post Machining):
      可以進? CNC、研磨、?絲等製程。
      Finish goods can do CNC machining, abrasion, and brushing.
      壽命(Life):
      7 ?以上。
      Above 7 years.
      ?產性(Productivity):
      已交貨 150 萬pcs 以上,使用客戶IBM、HP、Sapphire。
      More than 1.5 KK pcs ship out. The end users are IBM, HP, Sapphire.
      產能(Capacity):
      200K pcs/Month
      RoHS:
      符合 RoHS 要求。
      RoHS compliance.

      樣品時程(Sample Schedule):
      設計圖面確認後 1~2 週工作天可完成。
      After drawing confirmed, finished in 1 ~ 2 weeks.
      ?產時程(Production Schedule):
      收到訂單後 1 個月可交第一批貨。
      After receiving PO, the first batch can be ship out in 1 month.
      應用 Application
      IT 產品(IT Product):
      高階伺服器、伺服器、顯示卡、桌上型電腦、筆記型電腦。
      High End Server, Server, Graphic Card, Desktop Computer, Note Book
      高功?LED( High Power LED)
      通訊暨網?設備(Telecom/Networking Equipment):
      高端通訊設備、交換器、?由器。
      High End communication and telecom equipment, Switch, Router
      電?系統(Power System):

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